SEOULTECH
SeoulTechNews
[2019.10] ¼­¿ï°úÇбâ¼ú´ëÇб³ ´º½º·¹ÅÍ Á¦88È£ ´º½º·¹ÅÍ ±¸µ¶½Åû

 
È®´ë¾ÆÀÌÄÜÃà¼Ò¾ÆÀÌÄÜ¿øº¹¾ÆÀÌÄÜ Æ®À§ÅÍ °øÀ¯Çϱâ(»õâ) ÆäÀ̽ººÏ °øÀ¯Çϱâ(»õâ)
Á¤ÈƼ±(¹Ú»ç°úÁ¤), ¾È¿µ¼®(¼®»ç°úÁ¤) ¾¾, ISMP ¿ì¼ö ¹ßÇ¥ ³í¹®»ó
³ª³ëITµðÀÚÀÎÀ¶ÇÕ´ëÇпø, MEMS(¸â½º) ¹× ¸¶ÀÌÅ©·ÎÆÐŰ¡ ·¦ ¼ö»ó¼Ò½Ä

¼­¿ï°úÇбâ¼ú´ëÇб³ ³ª³ëITµðÀÚÀÎÀ¶ÇÕ´ëÇпøÀÇ MEMS(¸â½º) ¹× ¸¶ÀÌÅ©·ÎÆÐŰ¡ ·¦(Áöµµ±³¼ö Á¼ºÈÆ) ¼Ò¼Ó ¹Ú»ç°úÁ¤ Á¤ÈƼ±, ¼®»ç°úÁ¤ ¾È¿µ¼® ¾¾°¡ Áö³­ 10¿ù 24ÀϺÎÅÍ 26ÀϱîÁö °æ±âµµ ÆÄÁÖ Å²Åؽº Àü½ÃȦ¿¡¼­ °³ÃÖµÈ ¡¸Á¦15ȸ ISMP(International Symposium on Microelectronics and Packaging)¡¹ Çмú´ëȸ¿¡¼­ ¿ì¼ö Æ÷½ºÅÍ ¹ßÇ¥³í¹®»óÀ» °¢°¢ ¼ö»óÇÏ¿´´Ù.


  ¡ã (¿ÞÂʺÎÅÍ) ¹Ú»ç°úÁ¤ Á¤ÈƼ±, ¼®»ç°úÁ¤ ¾È¿µ¼® ¾¾

Á¤ÈƼ± ¾¾´Â "Experimental and Numerical Analysis of Protrusion of a Copper-Nickel Alloy in a Through-Silicon Via"À¸·Î ¹ßÇ¥¸¦ ÇÏ¿´°í, ¾È¿µ¼® ¾¾´Â ¡°Flexible Transparent Multi-Touch and Pressure Sensor Using AgNW/PEDOT:PSS Hybrid Film¡°·Î ¹ßÇ¥¸¦ ÇÏ¿© °¢°¢ ¿ì¼ö Æ÷½ºÅÍ ¹ßÇ¥³í¹®»óÀ» ¼ö»óÇÏ¿´´Ù. ISMP´Â ±¹³» ¹ÝµµÃ¼ ¹× ¹ÝµµÃ¼ ÆÐŰ¡ ±â¾÷ÀÌ ÁÖÃàÀÌ µÈ ±¹Á¦ ½ÉÆ÷Áö¿òÀ¸·Î¼­ ¿ÃÇØ ´ëȸ¿¡µµ Àü ¼¼°è ¿©·¯ ±â¾÷°ú ´ëÇп¡¼­ Âü°¡Çß´Ù. 

ÇÑÆí, Áöµµ±³¼ö Á¼ºÈÆ ±³¼ö´Â ¿ÃÇØ ¼¼°è ÃÖ°í ¼öÁØÀÇ ³í¹®ÀÎ Nature Communication Àú³Î µîÀç ¹× IEC ±¹Á¦Ç¥ÁرⱸÀÇ ¹Ì¼ÒÀü±â±â°è½Ã½ºÅÛ(MEMS) ºÐ¾ßÀÇ ±¹Á¦ÀÇÀåÀ¸·Î ¼±ÃâµÈ ¹Ù ÀÖ´Ù.



[2016-12-28, 13:36:20]

Æ®À§ÅÍ °øÀ¯Çϱâ(»õâ) ÆäÀ̽ººÏ °øÀ¯Çϱâ(»õâ)
¸ñ·Ï¹öÆ°  Ãâ·Â¹öÆ° 
 
´ëÇРȨÆäÀÌÁö | ÀÔÇоȳ» ȨÆäÀÌÁö | ½Å¹®»ç | »êÇÐÇù·Â´Ü
¸ÞÀÎÀ¸·Î | Áö³­È£º¸±â | ±â»ç°Ë»ö
±¹¸³¼­¿ï°úÇбâ¼ú´ëÇб³ ¹ßÇàó ¼­¿ï°úÇбâ¼ú´ëÇб³  |  ¹ßÇàÀÎ È«º¸½Ç  |  e-Mail newsletter@seoultech.ac.kr
01811 ¼­¿ï½Ã ³ë¿ø±¸ °ø¸ª·Î 232 ¼­¿ï°úÇбâ¼ú´ëÇб³  |  TEL 02-970-6114
Copyright ¨Ï 2012 SEOUL NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY. All Rights Reserved.
º» ¸ÞÀÏÀº ¹ß½ÅÀü¿ë ¸ÞÀÏÀÔ´Ï´Ù. ´õ ÀÌ»ó ¸ÞÀϼö½ÅÀ» ¿øÇÏÁö ¾ÊÀ¸½Ã¸é [¼ö½Å°ÅºÎ]¸¦ Ŭ¸¯ÇØ ÁֽʽÿÀ.